4JET microtech GmbH & Co. KG presents its new CUBE micromachining tool during LASER 2017 in Munich.
Targeting laser applications “on or in glass” the system allows to structure thin-films, cut or drill glass and other brittle materials. Fixed beam and galvo scanner options also enable other materials processing application.
Cutting
Drilling
Patterning
Key applications include laser processing glass wafers or substrates for electronic, optical or medical applications. However, the system can be easily reconfigured for other processing applications in industry or R+D.
The granite motion system with a repeat accuracy of better 2 µm in all three dimensions combined with CCD alignment cameras as well as an offset detection guarantee for a part accuracy in the single digit micron range.
Substrates up to 600 x 600 mm2 can be processed. Workpiece trays allow automatic cassette loading.
Key design objectives of the system – besides economical pricing – were a compact size and quick ramp-up times. Therefore laser source and controls are embedded in the machine enclosure.
The 4JET control suite allows easy import of CAD files and CAD to G-Code conversion. Other features include auto calibration, a vacuum chuck with integrated debris collection as well as an integrated laser power measurement.
Several of the new CUBE systems will be installed in 2017.
