Benefit from 4Jet’s high tech equipment and process solutions for prototypes and small to volume production needs – without the initial capital investment.
We offer sub-contract processing with state of the art laser equipment. Our spectrum of laser wavelength reaches from 355 nm, 532 nm, 1064 nm up to 10,6 µm with pulse length of fs, ps, ns to cw.
We support production needs from initial sampling up to 100% quality controlled end-products. Our analytical lab includes light and measurement microscopy, as well as surface analytical equipment.
Need the total package? We provide substrate-sourcing, cleaning, packaging, and door-to-door logistics.
The 4JET MicroFab
One-Stop Shopping for laser processed parts with high quality and precision.
Thickness of Material
Glass and Sapphire
Laser Glass processing
Flexible, clean and precise
Our process systems are capable of free form cutting almost any outer contours, including curves, as well as cutting inner contours.
The nearly dust free processing allows us to process your high end components and sensitve coated parts.
Our high precision systems produce a component accuracy in the micron range. Our glass cutting technology provides glass edge quality of < 2 µm, which reduces further processing in production such as mechanical polishing.>
Ablation of thin layers
The perfect application for our laser machines
Precise ablation of thin conductive oxides without lithography masks for electrical interconnection: ITO, ZnO, Nanowire, Silver, etc., as well as OLED post processing and customization.
Large area surface ablation (full or selective) of functional layers – such as edge deletion, surface preparation for subsequent bonding processes or optical effects.
Marking with pulsed laser – high contrast logos, data matrix codes and serial numbers – annealing colors, ablation and inside glass marking.
3 simple steps to the 4JET MicroFab
Fill out the inquiry form,
and upload sketches
or CAD drawings.
We will contact you
in the next 24 hours.
Receive our offer within one
working day after clarification of